I-COM-HPC-sIDH-2796-X557 Dev Kit

ADLINK Technology
976-ICOMHPCS2796X557
I-COM-HPC-sIDH-2796-X557 Dev Kit

Mfr.:

Description:
Development Boards & Kits - x86 COM-HPC Intel Ice Lake-D HCC development kit with D-2796 CPU module, with carrier, X557 OCP, heatsink and accessories

Lifecycle:
New Product:
New from this manufacturer.

Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$5,827.09 $5,827.09

Product Attribute Attribute Value Select Attribute
ADLINK Technology
Product Category: Development Boards & Kits - x86
Development Kits
Xeon D-2796
COM-HPC-sIDH-D-2796TE
Brand: ADLINK Technology
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: Not Available
Product Type: Development Boards & Kits - x86
Factory Pack Quantity: 1
Subcategory: Development Tools
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Attributes selected: 0

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