ATS019019020-SF-6S

Advanced Thermal Solutions
984-ATS019019020SF6S
ATS019019020-SF-6S

Mfr.:

Description:
Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Straight, No TIM, 19x19x20mm

Datasheet:
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Learn more about Advanced Thermal Solutions ATS019019020-SF-6S

In Stock: 50

Stock:
50 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$7.05 $7.05
$6.65 $66.50
$6.28 $125.60
$5.91 $295.50
$5.54 $554.00
$5.26 $1,052.00
$5.07 $2,535.00
$4.88 $4,880.00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
PCB
Aluminum
Straight Fin
6.46 C/W
19 mm
19 mm
20 mm
Brand: Advanced Thermal Solutions
Color: Black
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Packaging: Bulk
Product Type: Heat Sinks
Series: BGA High Aspect Ratio
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: Value-Line Platform
Type: Component
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Attributes selected: 0

Datasheet

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CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera®, AMD, Freescale, Intel®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.

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