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ATS035035007-SF-11F

Name: Advanced Thermal Solutions ATS035035007-SF-11F
Brand: Advanced Thermal Solutions
SKU: 984-AT035035007SF11F
Price: 5.81 USD
Availability: InStock

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Mouser No:

984-AT035035007SF11F

Mfr. No:

ATS035035007-SF-11F

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Straight, No TIM, 35x35x7mm

Datasheet:

ATS035035007-SF-11F Datasheet (PDF)

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$5.81	$5.81
	$5.54	$55.40
	$5.39	$107.80
	$5.09	$254.50
	$4.79	$479.00
	$4.49	$898.00
	$4.34	$2,170.00
	$4.02	$4,020.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	PCB
Heatsink Material:	Aluminum
Fin Style:	Straight Fin
Thermal Resistance:	13.39 C/W
Length:	35 mm
Width:	35 mm
Height:	7 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	BGA High Aspect Ratio
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	Value-Line Platform
Type:	Component

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Datasheet

ATS035035007-SF-11F Datasheet (PDF)

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USHTS:: 7616995100
ECCN:: EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera^®, AMD, Freescale, Intel^®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.