2817167

Bergquist Company
951-2817167
2817167

Mfr.:

Description:
Thermal Interface Products Higher Performance, High Reliability Insulator, Sil-Pad TSP A3000 / A2000 Series
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Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
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Stock:
0

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Factory Lead Time:
10 Weeks Estimated factory production time.
Minimum: 56   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$16.29 $912.24
$15.34 $1,534.00
$14.61 $3,652.50
$14.08 $7,040.00

Product Attribute Attribute Value Select Attribute
Bergquist Company
Product Category: Thermal Interface Products
RoHS:  
A2000 / TSP A3000
Brand: Bergquist Company
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Product Type: Thermal Interface Products
Factory Pack Quantity: 4500
Subcategory: Thermal Management
Tradename: Sil-Pad
Part # Aliases: TSP A3000-0.015-AC-38
Unit Weight: 1.553 g
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Datasheet

TSP A3000 High Performance SIL PAD®

Bergquist Company TSP A3000 High-Performance SIL PAD® are conformable elastomers with ultra-high 3W/m.K thermal conductivity that acts as a thermal interface between electrical components and heat sinks. These inductors are designed for applications where optimal heat transfer is required. These thermally conductive silicone elastomers offer a thermal impedance of 0.32°C-in2/W (at 50psi). They are formulated to maximize the thermal and dielectric performance of the filler/binder matrix. This results in a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high-reliability electronic packaging applications. Bergquist Company SIL PAD TSP A3000 High-Reliability Insulators are ideal for use in motor drive controls, avionics applications, high-voltage power supplies, and power transistor/heat sink interfaces.

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.

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