3041248

Bergquist Company
951-3041248
3041248

Mfr.:

Description:
Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial

Lifecycle:
New Product:
New from this manufacturer.
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 2   Multiples: 1
Unit Price:
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Ext. Price:
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Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$390.02 $780.04
$359.36 $3,593.60
$333.69 $8,342.25

Product Attribute Attribute Value Select Attribute
Bergquist Company
Product Category: Thermal Interface Products
RoHS:  
TGP 10000ULM
Brand: Bergquist Company
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Product Type: Thermal Interface Products
Factory Pack Quantity: 1
Subcategory: Thermal Management
Tradename: GAP PAD
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GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

Data Centre Applications

Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

Router Switch & Network Applications

Bergquist Company Router Switch and Network Applications include phase change materials and thermally conductive adhesives designed to dissipate heat away from thermally sensitive components. The utilization of advanced materials in server motherboards and line cards for routers and switches offers benefits such as scale and cost reduction. One small uptick in performance, repeated thousands of times, provides a notable impact on router and switch performance. Thermal products from Bergquist Company help components function properly for optimal operation.

Storage Applications

Bergquist Company Storage Applications feature advanced materials used in storage hardware to provide increased reliability, greater stability, and improved transfer rates. Every uptick in reliability and performance lowers costs while meeting increased user expectations. The thermal management materials from Bergquist Company include a broad variety of product types to meet various application needs.

Server Applications

Bergquist Company Server Applications feature thermal management products designed for a wide range of use — from a few servers in a closet to thousands of them in a data center. No matter the number of servers, a slight reduction in heat or improvement in component performance can significantly impact infrastructure operation. Bergquist Company offers advanced materials for use throughout a circuit board, helping to optimize performance and the corresponding network.

TGP 10000ULM 10W/m-K Extremely Soft GAP PAD®

Bergquist TGP 10000ULM 10W/m-K Extremely Soft GAP PAD® offers a UL94V-0 flammability rating, 10W/m-K thermal conductivity, and -60°C to +200°C operating temperature range. These GAP PADs are highly conformal to rough or irregular surfaces, and protective liners are supplied on both sides, allowing for ease of use. The TGP10000ULM's material offers exceptional thermal performance at low pressures due to the unique filler package and ultra-low modulus resin formulation. Bergquist TGP10000ULM Ultra-Low Modulus GAP PADs are ideal for optical transceivers, DSPs, and telecommunication applications.

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