S40X043131JP

CTS Electronic Components
774-S40X043131JP
S40X043131JP

Mfr.:

Description:
Resistor Networks & Arrays RES ARRAY, CONVEX, 2 RES 0201, ISOLATED, 130 OHMS 5

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

Availability

Stock:
Non-Stocked
Factory Lead Time:
20 Weeks Estimated factory production time.
Minimum: 10000   Multiples: 10000
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
Full Reel (Order in multiples of 10000)
$0.117 $1,170.00

Similar Products

Product Attribute Attribute Value Select Attribute
CTS
Product Category: Resistor Networks & Arrays
RoHS:  
Reel
S4x
Arrays
SMD/SMT
130 Ohms
5 %
Isolated
2 Resistor
4 Pin
200 PPM / C
- 55 C
+ 125 C
0302 (0806 metric)
0.85 mm
0.6 mm
0.35 mm
Brand: CTS Electronic Components
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Lead Spacing: 0.5 mm
Power per Element: 31 mW
Product Type: Resistor Networks & Arrays
Factory Pack Quantity: 10000
Subcategory: Resistors
Type: Chip Resistor Arrays
Voltage Rating: 12.5 V
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

USHTS:
8533210020
JPHTS:
853321000
TARIC:
8533210000
ECCN:
EAR99

S4x Sulfur Resistant Chip Resistor Arrays

CTS Electronic Components S4x Series Sulfur Resistant Chip Resistor Arrays are specifically designed to resist sulfurization that occurs in high-sulfur environments. The standard chip and chip array resistor products get corroded in high sulfurous environments and a layer of silver sulfide (Ag2S) is formed. This sulfide chemical can crack the ceramic substrate and create a very high resistance path between resistor connections to function as an open circuit connection. The design of S4x Series Chip Resistor Arrays adds a protective layer between the silver (Ag) conductor and the final epoxy cover coat layer. This barrier prevents the fusion of sulfur into the silver interface avoiding sulfide growth.