AD7-30S

Chip Quik
910-AD7-30S
AD7-30S

Mfr.:

Description:
Liquid Dispensers & Bottles Thermoset Chip Bonding Epoxy (Red) 30g/30cc syringe (Thermal (Heat) Cure Adhesive/Glue)

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
More Information
Learn more about Chip Quik AD7-30S

In Stock: 24

Stock:
24 Can Dispatch Immediately
Factory Lead Time:
6 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$32.95 $32.95

Product Attribute Attribute Value Select Attribute
Chip Quik
Product Category: Liquid Dispensers & Bottles
RoHS:  
Syringes
Red
Brand: Chip Quik
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CA
Product Type: Bottles & Liquid Dispensers
Series: AD7
Factory Pack Quantity: 1
Subcategory: Supplies
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Attributes selected: 0

Datasheet

CAHTS:
3810100000
USHTS:
3810100000
JPHTS:
381010000
MXHTS:
3810100100
ECCN:
EAR99

AD7 Thermoset Chip Bonding Epoxy

Chip Quik AD7 Thermoset Chip Bonding Epoxy is designed to bond surface-mount chips and ICs to printed circuit boards (PCBs). The AD7 epoxy has low viscosity and is designed to be dot/line dispensed, allowing large and heavy surface-mount components to be permanently bonded to a PCB during reflow. This application enables two-sided mount reflow without larger chips or ICs coming loose. Curing time ranges from 120 to 180 seconds at the recommended curing temperature range of +190°C to +260°C. The maximum recommended dot size for Chip Quik AD7 Epoxy is 10mm x 10mm x 1mm.

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