2508053017Y3

Fair-Rite
623-2508053017Y3
2508053017Y3

Mfr.:

Description:
Ferrite Beads MultLyr Chip Bead 300 OHM 0805 3000mA

Datasheet:
ECAD Model:
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Learn more about Fair-Rite 2508053017Y3

In Stock: 133,240

Stock:
133,240
Can Dispatch Immediately
On Order:
100,000
Factory Lead Time:
20
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (USD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
$0.10 $0.10
$0.062 $0.62
$0.049 $1.23
$0.044 $4.40
$0.038 $9.50
$0.034 $17.00
$0.03 $30.00
Full Reel (Order in multiples of 4000)
$0.024 $96.00
† A MouseReel™ fee of $7.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fair-Rite
Product Category: Ferrite Beads
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
0805 (2012 metric)
300 Ohms
3 A
25 %
50 mOhms
- 55 C
+ 125 C
2 mm
1.25 mm
0.9 mm
Reel
Cut Tape
MouseReel
Brand: Fair-Rite
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Product Type: Ferrite Beads
Factory Pack Quantity: 4000
Subcategory: Ferrites
Test Frequency: 100 MHz
Type: Multilayer Ferrite Chip Bead
Unit Weight: 5.500 mg
Products found:
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Attributes selected: 0

Datasheet

CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
KRHTS:
8504509090
TARIC:
8504509590
MXHTS:
8504509102
BRHTS:
85045000
ECCN:
EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.

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