A10235-31

Laird Technologies
739-A10235-31
A10235-31

Mfr.:

Description:
Thermal Interface Products Tputty 502 60 FG2 9x9" 3W/mK XSoft

Datasheet:
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Learn more about Laird Technologies A10235-31

In Stock: 22

Stock:
22 Can Dispatch Immediately
Factory Lead Time:
10 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$174.20 $174.20
$156.26 $1,562.60
250 Quote

Product Attribute Attribute Value Select Attribute
Laird Technologies
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Boron Nitride
3 W/m-K
5 kVAC
White
- 45 C
+ 200 C
229 mm
1.52 mm
10 psi
UL 94 V-0
Tputty 502
Bulk
Brand: Laird Technologies
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Product Type: Thermal Interface Products
Factory Pack Quantity: 1
Subcategory: Thermal Management
Tradename: Tputty
Unit Weight: 288.706 g
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Attributes selected: 0

Datasheet

CAHTS:
8546900090
USHTS:
3919905060
KRHTS:
3919900000
TARIC:
3824999699
MXHTS:
3919909900
ECCN:
EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

TPutty™ Gap Fillers

Laird Technologies TPutty™ Gap Fillers are soft, low-abrasive, silicone-based thermal gap fillers ideal for applications where large or uneven gap tolerances are present. Gap filler is used to bridge the interface between hot components and a chassis or heat sink assembly when the elimination of mechanical stress or bulk dispensing are critical design considerations. The material allows for the transfer of little to no pressure on mating parts. With a UL 94V-0 flammability rating, Laird Technologies TPutty™ Gap Fillers provide excellent thermal performance and compliance.

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