170382-0003

Molex
538-170382-0003
170382-0003

Mfr.:

Description:
I/O Connectors ZXP zSFP 20ckt Gold Flash Solder Area

ECAD Model:
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In Stock: 610

Stock:
610 Can Dispatch Immediately
Factory Lead Time:
15 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 480)

Pricing (USD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
$5.86 $5.86
$5.33 $53.30
$5.05 $126.25
$4.94 $247.00
$4.70 $470.00
$4.11 $1,027.50
Full Reel (Order in multiples of 480)
$3.99 $1,915.20
$3.41 $3,273.60
$3.17 $7,608.00
† A MouseReel™ fee of $7.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Molex
Product Category: I/O Connectors
RoHS:  
I/O Connectors
Female
20 Position
0.8 mm
30 V
Gold
PCB Mount
SMD/SMT
Right Angle
170382
- 40 C
+ 85 C
Reel
Cut Tape
MouseReel
Brand: Molex
Color: Black
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 500 mA
Flammability Rating: UL 94 V-0
Housing Material: Thermoplastic (TP)
Number of Ports: 1 Port
Product Type: I/O Connectors
Factory Pack Quantity: 480
Subcategory: I/O Connectors
Part # Aliases: 1703820003 01703820003
Unit Weight: 861 mg
Products found:
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Attributes selected: 0

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).