170510-1127

Molex
538-170510-1127
170510-1127

Mfr.:

Description:
High Speed/Modular Connectors Impact 3x10 85-Ohm Dual Wall RAM .39

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 216   Multiples: 216
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$19.63 $4,240.08
$19.06 $8,233.92

Product Attribute Attribute Value Select Attribute
Molex
Product Category: High Speed/Modular Connectors
RoHS:  
Headers
90 Position
9 Row
1.35 mm, 1.9 mm
Through Hole
Gold
170510
Tray
Brand: Molex
Contact Material: Tin
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Current Rating: 750 mA
Housing Colour: Gray
Housing Material: Thermoplastic
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Mounting Angle: Right Angle
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 1
Subcategory: Backplane Connectors
Tradename: Impact
Voltage Rating: 30 V
Unit Weight: 9.303 g
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Attributes selected: 0

Datasheet

Models

CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

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