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171565-3003

Name: Molex 171565-3003
Brand: Molex
SKU: 538-171565-3003
Price: 147.7 USD
Availability: OutOfStock

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Mouser No:

538-171565-3003

Mfr. No:

171565-3003

Mfr.:

Molex

Description:

I/O Connectors zQSFP+ Stkd 2x3 Conn wElastomeric LP DU

Datasheet:

171565-3003 Datasheet

ECAD Model:

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More Information

Learn more about Molex 171565-3003

Availability

Stock:: Non-Stocked

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Factory Lead Time:: Request Delivery Quote

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Minimum: 24 Multiples: 24

Unit Price:

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Ext. Price:

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Est. Tariff:

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$147.70	$3,544.80
	$142.77	$6,852.96
120	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	I/O Connectors
RoHS:
REACH - SVHC:
Product:	SFP Connectors
Gender:	Female
Number of Positions:	228 Position
Pitch:	0.8 mm
Voltage Rating:	30 V
Contact Plating:	Gold
Mounting Style:	PCB Mount
Termination Style:	Through Hole
Mounting Angle:	Right Angle
Series:	171565
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Tray
Brand:	Molex
Color:	Black
Contact Material:	Copper Alloy
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	500 mA
Flammability Rating:	UL 94 V-0
Housing Material:	Thermoplastic (TP)
Number of Ports:	6 Port
Product Type:	I/O Connectors
Factory Pack Quantity:	24
Subcategory:	I/O Connectors
Tradename:	zQSFP+
Type:	zQSFP
Unit Weight:	96.028 g

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Datasheet

171565-3003 Datasheet

Models

PCN

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zQSFP+ EMI Cages

Molex zQSFP+ EMI Cages are designed with an advanced heat-sink system to provide a high level of heat dissipation for next-generation system power levels. The die-cast design features a screw-down option to the PCB for maximum board retention. The spring-finger design provides optimal EMI grounding and allows for more space to route high-speed traces.

zQSFP+ I/O Connectors

Molex zQSFP+ interconnect solution conforms to SFF-8665 QSFP28 and is designed for high-density interconnect applications. Components of the system include SMT connectors and stacked integrated 2-by-1, 2-by-2, and 2-by-3 connectors and cages. Molex zQSFP+ SMT connectors support 100Gbps Ethernet and 100Gbps InfiniBand (IB) Enhanced Data Rate (EDR) applications.