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215759-1007

Name: Molex 215759-1007
Brand: Molex
SKU: 538-215759-1007
Price: 0.6 USD
Availability: InStock

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Mouser No:

538-215759-1007

Mfr. No:

215759-1007

Mfr.:

Molex

Description:

Headers & Wire Housings Micro-Fit+ RecepHousing 7Circuits Black

Datasheet:

215759-1007 Datasheet

ECAD Model:

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Learn more about Molex 215759-1007

In Stock: 4,272

Stock:: 4,272 Can Dispatch Immediately

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$0.60	$0.60
	$0.535	$5.35
	$0.50	$12.50
	$0.468	$46.80
	$0.443	$110.75
	$0.391	$391.00
	$0.377	$829.40
	$0.372	$1,636.80
	$0.36	$3,960.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Wire Housings
Type:	Receptacle Housing
Number of Positions:	7 Position
Pitch:	3 mm (0.118 in)
Number of Rows:	1 Row
Mounting Style:	Cable Mount / Free Hanging
Termination Style:	Crimp
Mounting Angle:	Straight
Series:	215759
Tradename:	Micro-Fit+
Application:	Wire-to-Board, Power
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 105 C
Brand:	Molex
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Flammability Rating:	UL 94 V-0
Housing Colour:	Black
Housing Gender:	Receptacle
Housing Material:	Polyamide (PA)
Insulation Resistance:	1 GOhms
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	2200
Subcategory:	Headers & Wire Housings
Part # Aliases:	2157591007 02157591007

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Technical Resources

USHTS:: 8538906000
JPHTS:: 853890000
MXHTS:: 8538900100
BRHTS:: 85389090
ECCN:: EAR99

Micro-Fit+ Connectors

Molex Micro-Fit+ Connectors offer superior design options for flexibility and efficient assembly. The connectors offer a high current rating of up to 13.5A with a 3mm pitch and use the same amount of space that smaller connectors occupy. Features include a smaller PCB footprint, a reduced mating force of 40%, and an enhanced TPA design that provides stability and security for the terminals inside the receptacle. Molex Micro-Fit+ applications include consumer, telecommunication/networking, medical, sustainable energy, and automotive.