76015-5103

Name: Molex 76015-5103
Brand: Molex
SKU: 538-76015-5103
Price: 34.54 USD
Availability: OutOfStock

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Mouser No:

538-76015-5103

Mfr. No:

76015-5103

Mfr.:

Molex

Description:

High Speed/Modular Connectors I-TRAC 7 ROW BP ASSY - 10COL GUIDE RIGHT

Datasheet:

76015-5103 Datasheet

ECAD Model:

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$34.54	$34.54
	$29.36	$293.60
	$28.04	$701.00
	$27.13	$1,356.50
	$26.23	$2,623.00
	$24.78	$7,434.00
600	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	140 Position
Number of Rows:	7 Row
Pitch:	1.85 mm
Termination Style:	Solder Pin
Contact Plating:	Gold
Series:	76015
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	MY
Current Rating:	1 A
Housing Material:	Thermoplastic (TP)
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	150
Subcategory:	Backplane Connectors
Tradename:	GbX I-Trac
Voltage Rating:	120 VAC/DC
Part # Aliases:	0760155103
Unit Weight:	8.123 g

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Datasheet

76015-5103 Datasheet

Models

PCN

RoHS Certificate (PDF)

CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

GbX I-Trac Backplane Connector System

The GbX I-Trac Vertical Header Backplane Connector System achieves superior impedance control and 12.5Gbps data rates in high-bandwidth applications. The connectors feature a unique open pin-field design, offering flexibility to assign high-speed differential pairs, low-speed signals, and power/ground contacts anywhere within the pin field.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.