76020-3004

Molex
538-76020-3004
76020-3004

Mfr.:

Description:
High Speed/Modular Connectors I-Trac dcard assy 7r ow 4col guide lft sn

ECAD Model:
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In Stock: 579

Stock:
579
Can Dispatch Immediately
On Order:
249
Factory Lead Time:
21
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$21.67 $21.67
$18.42 $184.20
$17.27 $431.75
$16.44 $822.00
$15.89 $1,589.00
$15.02 $3,965.28
$14.58 $7,698.24

Product Attribute Attribute Value Select Attribute
Molex
Product Category: High Speed/Modular Connectors
RoHS:  
Receptacles
56 Position
7 Row
3.7 mm
Solder Pin
Gold
76020
Tray
Brand: Molex
Contact Material: Tin
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: MY
Current Rating: 1 A
Housing Material: Thermoplastic (TP)
Maximum Operating Temperature: + 80 C
Minimum Operating Temperature: - 55 C
Mounting Angle: Right Angle
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 264
Subcategory: Backplane Connectors
Tradename: GbX I-Trac
Voltage Rating: 120 VAC/DC
Part # Aliases: 0760203004
Unit Weight: 9.206 g
Products found:
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Attributes selected: 0

CNHTS:
8536901900
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

GbX I-Trac Backplane Connector System

The GbX I-Trac Vertical Header Backplane Connector System achieves superior impedance control and 12.5Gbps data rates in high-bandwidth applications. The connectors feature a unique open pin-field design, offering flexibility to assign high-speed differential pairs, low-speed signals, and power/ground contacts anywhere within the pin field.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.