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78350-2011

Name: Molex 78350-2011
Brand: Molex
SKU: 538-78350-2011
Price: 16.19 USD
Availability: OutOfStock

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Mouser No:

538-78350-2011

Mfr. No:

78350-2011

Mfr.:

Molex

Description:

High Speed/Modular Connectors Impact Pwr 4P RA Rec HdnPF.76AuLF 8Ckt

Datasheet:

78350-2011 Datasheet

ECAD Model:

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Availability

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Unit Price:

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Ext. Price:

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Est. Tariff:

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$16.19	$3,561.80
	$15.30	$5,049.00
	$14.85	$8,167.50

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Number of Positions:	8 Position
Number of Rows:	2 Row
Pitch:	5.2 mm
Termination Style:	Through Hole
Contact Plating:	Gold
Series:	78350
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	ID
Current Rating:	20 A
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	22
Subcategory:	Backplane Connectors
Tradename:	Impact
Voltage Rating:	250 V
Part # Aliases:	783502011 0783502011
Unit Weight:	20.036 g

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Datasheet

78350-2011 Datasheet

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PCN

Materials Change (PDF)

Technical Resources

RoHS Certificate (PDF)

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.