78731-1007

Molex
538-78731-1007
78731-1007

Mfr.:

Description:
DIMM Connectors 0.85MM DDR4 DIMM Vt PF 0.

Datasheet:
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 160   Multiples: 160
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$20.22 $3,235.20
$19.10 $6,112.00
$18.55 $8,904.00

Product Attribute Attribute Value Select Attribute
Molex
Product Category: DIMM Connectors
RoHS:  
DIMM
DDR4
288 Position
0.85 mm
PCB Mount
Through Hole
Vertical
Gold
750 mA
78731
Brand: Molex
Contact Material: Coper Alloy
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Latch Color: Black
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Packaging: Tray
Product Type: DIMM Connectors
Factory Pack Quantity: 160
Subcategory: Memory Connectors & Sockets
Tail Length: 3.53 mm
Voltage Rating: 29 VAC/DC
Part # Aliases: 787311007 0787311007
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Attributes selected: 0

Datasheet

Application Notes

Models

Specification Sheets

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

DDR4 DIMM Sockets

Molex DDR4 DIMM Sockets are ideal for the latest generation of DDR/SDRAM in DIMM format. DDR4 products offer a 100% increase in speed, 30% increase in density, and 20% decrease in required voltage compared to other DDR/SDRAM offerings. These DIMM sockets support UDIMM, RDIMM, and LRDIMM memory applications over a wide range of high-speed data, computing, telecommunication, and networking servers with a data speed of 3.2 billion transfers per second.

78731 Vertical Press-fit DIMM Socket

Molex 78731 Vertical Press-Fit DDR4 DIMM Socket supports UDIMMs, RDIMMs, and LRDIMM memory applications for data, computing, telecommunication, and networking servers with higher data speed and lower operating voltage than DDR3. The Press-fit DDR4 DIMM socket offers benefits of lower cost of operation (clean, solderless process), elimination of added heat-cycle that can cause stress to the PCB or degrade electronic components, ease of application and connection-failure traceability, rework and termination quality inspection, repair capability, and more.

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