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87754-0462

Name: Molex 87754-0462
Brand: Molex
SKU: 538-87754-0462
Price: 0.36 USD
Availability: InStock

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Mouser No:

538-87754-0462

Mfr. No:

87754-0462

Mfr.:

Molex

Description:

Headers & Wire Housings 2mm SRSW Hdr RA 2.5SnLF 4Ckt

Datasheet:

87754-0462 Datasheet

ECAD Model:

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In Stock: 4,967

Stock:: 4,967 Can Dispatch Immediately

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$0.36	$0.36
	$0.302	$3.02
	$0.257	$25.70
	$0.23	$57.50
	$0.219	$219.00
	$0.213	$383.40
	$0.196	$1,058.40
	$0.185	$1,998.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Type:	Breakaway
Number of Positions:	4 Position
Pitch:	2 mm (0.079 in)
Number of Rows:	1 Row
Mounting Style:	Through Hole
Termination Style:	Solder Pin
Mounting Angle:	Right Angle
Contact Gender:	Pin (Male)
Contact Plating:	Tin
Mating Post Length:	7.2 mm (0.283 in)
Termination Post Length:	3 mm (0.118 in)
Series:	87754
Tradename:	Milli-Grid
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	ID
Current Rating:	2 A
Flammability Rating:	UL 94 V-0
Housing Colour:	Black
Housing Material:	Nylon
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	1800
Subcategory:	Headers & Wire Housings
Voltage Rating:	125 V
Part # Aliases:	877540462 0877540462
Unit Weight:	155 mg

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Datasheet

87754-0462 Datasheet

Models

RoHS Certificate (PDF)

CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

MolexFamMilliGrid

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.