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87759-2014

Name: Molex 87759-2014
Brand: Molex
SKU: 538-87759-2014
Price: 2.55 USD
Availability: InStock

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Mouser No:

538-87759-2014

Mfr. No:

87759-2014

Mfr.:

Molex

Description:

Headers & Wire Housings MGrid Hdr SMT D/R W/ W/OCap .38AuLF 20Ckt

Datasheet:

87759-2014 Datasheet

ECAD Model:

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In Stock: 847

Stock:: 847 Can Dispatch Immediately

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Ext. Price:

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$2.55	$2.55
	$2.42	$24.20
	$2.02	$52.52
	$1.83	$190.32
	$1.82	$473.20
	$1.63	$847.60
	$1.43	$1,450.02
	$1.39	$6,975.02

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Type:	Breakaway
Number of Positions:	20 Position
Pitch:	2 mm (0.079 in)
Number of Rows:	2 Row
Row Spacing:	2 mm (0.079 in)
Mounting Style:	SMD/SMT
Termination Style:	Solder
Mounting Angle:	Straight
Contact Gender:	Pin (Male)
Contact Plating:	Gold
Mating Post Length:	3.8 mm (0.15 in)
Series:	87759
Tradename:	Milli-Grid
Application:	Board-to-Board, Signal
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Tube
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	ID
Current Rating:	2 A
Flammability Rating:	UL 94 V-0
Housing Material:	Nylon
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	26
Subcategory:	Headers & Wire Housings
Voltage Rating:	125 V
Part # Aliases:	0877592014
Unit Weight:	488 mg

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Datasheet

87759-2014 Datasheet

Models

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

MolexFamMilliGrid

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.