OSDZU3EG1-2G-IFA

Octavo Systems
415-OSDZU3EG1-2G-IFA
OSDZU3EG1-2G-IFA

Mfr.:

Description:
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C

Lifecycle:
New At Mouser
Datasheet:
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Learn more about Octavo Systems OSDZU3EG1-2G-IFA

In Stock: 3

Stock:
3
Can Dispatch Immediately
On Order:
3
Factory Lead Time:
20
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$721.03 $721.03
$678.89 $8,146.68

Product Attribute Attribute Value Select Attribute
Octavo Systems
Product Category: System-On-Modules - SOM
RoHS:  
OSDZU3
Standard BGA
XCZU3EG1
2 GB
4.5 V to 5.5 V
CAN, I2C, SPI, UART, USB
- 40 C
+ 85 C
20.5 mm X 40 mm
Tray
Brand: Octavo Systems
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Moisture Sensitive: Yes
Number of Cores: 6
On-Board Storage Size: 32 MB
On-Board Storage Type: QSPI
Product Type: System-On-Modules - SOM
Factory Pack Quantity: 6
Subcategory: Computing
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Attributes selected: 0

Datasheet

USHTS:
8542310050

OSDZU3 AMD-Xilinx Zynq UltraScale+ ZU3 SiPs

Octavo Systems OSDZU3 AMD-Xilinx Zynq UltraScale+ ZU3 System-in-Packages (SiPs) are a fast, flexible way to develop a system around the AMD Xilinx® Zynq® UltraScale+™ MPSoC. These SiPs allow users to harness the performance of the ZU3 MPSoC while removing the complexities without sacrificing flexibility. The OSZU3 SiPs integrate the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, with 2GB (16GB) LPDDR4, power management, and other required components into a single BGA package. This integration reduces design effort by months, allowing users to get to market faster or spend time adding more features to products.

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