DA-T268-401E-TR

Ohmite
588-DA-T268-401E-TR
DA-T268-401E-TR

Mfr.:

Description:
Heat Sinks TO-268 SMD HEAT SINK ANODZD

Datasheet:
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Learn more about Ohmite DA-T268-401E-TR

In Stock: 5,091

Stock:
5,091 Can Dispatch Immediately
Factory Lead Time:
28 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$2.94 $2.94
Full Reel (Order in multiples of 200)
$2.49 $498.00
$2.40 $5,760.00

Product Attribute Attribute Value Select Attribute
Ohmite
Product Category: Heat Sinks
RoHS:  
Heat Sinks
D3Pak (TO-268)
SMD/SMT
Aluminum
Extruded Axial Fin
31.1 mm
12.7 mm
11.7 mm
Brand: Ohmite
Color: Black
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Packaging: Reel
Packaging: Cut Tape
Product Type: Heat Sinks
Series: D
Factory Pack Quantity: 200
Subcategory: Heat Sinks
Type: Component
Unit Weight: 4 g
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Attributes selected: 0

Datasheet

Application Notes

CNHTS:
8473309000
USHTS:
8541900080
ECCN:
EAR99

D Series Heatsinks

Ohmite D Series Heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The heatsinks offer a low cost, large surface area, and a small footprint that can dissipate more heat. The unique patent-pending design combines tin-plated, solderable rods with an aluminum extruded heat sink body. These rods (or “rollers”) are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink body and the solderable feet. Specifically designed for use with the increasingly popular TO-252, TO-263, and TO-268 packages, the D Series affords the user superior thermal performance over the more common stamped aluminum heatsinks. By eliminating the staking joint typically used in stamped heatsinks, the resulting air gap and thermal “bottle-neck” is also eliminated, while the surface area for cooling is maximized with the extruded fins of the D Series body.

Ohmite Heatsinks

Ohmite Heatsinks have been designed to take advantage of thermal transfer, reliability, and design flexibility. Ohmite's heatsink product line utilizes a patented Matrix Clip system that provides constant spring force over repeated assembly and disassembly. The elimination of mounting hardware reduces costs and enables a maximum surface area per unit design. Ohmite heatsinks are designed to secure TO-126, TO-218, TO-220, TO-247, and TO-264 packages, plus provide thermal solutions for TO-252, TO-263, and TO-268 SMD devices.
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Heatsinks

Ohmite Heatsinks are engineered to take advantage of thermal transfer, reliability, and design flexibility. This heat sink product line utilizes a patented clip system that provides constant spring force over repeated assembly and disassembly. The elimination of mounting hardware reduces costs and enables a maximum surface area per unit design. Ohmite Heatsinks are designed to secure TO-126, TO-218, TO-220, TO-247, and TO-264 packages as well as provide thermal solutions for TO-252, TO-263, and TO-268 SMD devices.

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