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EYG-R0305ZLSM

Name: Panasonic EYG-R0305ZLSM
Brand: Panasonic
SKU: 667-EYG-R0305ZLSM
Price: 7.46 USD
Availability: OutOfStock

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Mouser No:

667-EYG-R0305ZLSM

Mfr. No:

EYG-R0305ZLSM

Mfr.:

Panasonic

Description:

Thermal Interface Products 51 mmx27 mmx0.25 mm250 W/m-K - 55 C+ 400 C

Datasheet:

EYG-R0305ZLSM Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 16 Weeks Estimated factory production time.

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Ext. Price:

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$7.46	$7.46
	$6.33	$63.30
	$5.84	$116.80
	$5.82	$291.00
	$5.64	$564.00
	$5.50	$1,100.00
	$5.37	$2,685.00
	$5.33	$5,330.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Panasonic
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	High Compressible Graphite Sheet
Package/Case:	Non-standard
Material:	Graphite
Thermal Conductivity:	250 W/m-K
Color:	Gray
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 400 C
Length:	51 mm
Width:	27 mm
Thickness:	0.25 mm
Tensile Strength:	600 kPa
Flammability Rating:	UL 94 V-0
Series:	EYGR
Packaging:	Bulk
Brand:	Panasonic
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	JP
Product Type:	Thermal Interface Products
Factory Pack Quantity:	10
Subcategory:	Thermal Management

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Datasheet

EYG-R0305ZLSM Datasheet (PDF)

CAHTS:: 8545900000
USHTS:: 8545904000
MXHTS:: 8545909900
ECCN:: EAR99

EYG-R GraphiteTIM Pyrolytic Graphite Sheets

Panasonic EYG-R GraphiteTIM Pyrolytic Graphite Sheets (PGS) is comprised of low thermal resistance thermal management material in 250µm and 350µm thickness options. An ideal Thermal Interface Material (TIM) solution, Panasonic EYG-R GraphiteTIM material is designed with high-compressibility characteristics to reduce contact thermal resistance between rough surfaces. EYG-R GraphiteTIM material is easy to install with a one-to-two-step process that is more cost-effective than thermal grease. GraphiteTIM has very high compressibility compared to standard PGS, which reduces thermal resistance by following gap, warpage, and distortion of targets/substrates.