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EYG-R0404ZLMP

Name: Panasonic EYG-R0404ZLMP
Brand: Panasonic
SKU: 667-EYG-R0404ZLMP
Price: 7.34 USD
Availability: OutOfStock

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Mouser No:

667-EYG-R0404ZLMP

Mfr. No:

EYG-R0404ZLMP

Mfr.:

Panasonic

Description:

Thermal Interface Products 38 mmx36 mmx0.25 mm250 W/m-K - 55 C+ 400 C

Datasheet:

EYG-R0404ZLMP Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 16 Weeks Estimated factory production time.

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Ext. Price:

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$7.34	$7.34
	$6.49	$64.90
	$6.12	$122.40
	$5.96	$298.00
	$5.74	$574.00
	$5.47	$1,094.00
	$5.27	$2,635.00
	$5.08	$5,080.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Panasonic
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	High Compressible Graphite Sheet
Package/Case:	Non-standard
Material:	Graphite
Thermal Conductivity:	250 W/m-K
Color:	Gray
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 400 C
Length:	38 mm
Width:	36 mm
Thickness:	0.25 mm
Tensile Strength:	600 kPa
Flammability Rating:	UL 94 V-0
Series:	EYGR
Packaging:	Bulk
Brand:	Panasonic
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	JP
Product Type:	Thermal Interface Products
Factory Pack Quantity:	10
Subcategory:	Thermal Management

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Datasheet

EYG-R0404ZLMP Datasheet (PDF)

CAHTS:: 8545900000
USHTS:: 8545904000
MXHTS:: 8545909900
ECCN:: EAR99

EYG-R GraphiteTIM Pyrolytic Graphite Sheets

Panasonic EYG-R GraphiteTIM Pyrolytic Graphite Sheets (PGS) is comprised of low thermal resistance thermal management material in 250µm and 350µm thickness options. An ideal Thermal Interface Material (TIM) solution, Panasonic EYG-R GraphiteTIM material is designed with high-compressibility characteristics to reduce contact thermal resistance between rough surfaces. EYG-R GraphiteTIM material is easy to install with a one-to-two-step process that is more cost-effective than thermal grease. GraphiteTIM has very high compressibility compared to standard PGS, which reduces thermal resistance by following gap, warpage, and distortion of targets/substrates.