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HDTM-6-08-1-S-VT-1-3

Name: Samtec HDTM-6-08-1-S-VT-1-3
Brand: Samtec
SKU: 200-HDTM6081SVT13
Price: 15.67 USD
Availability: OutOfStock

Mouser No:

200-HDTM6081SVT13

Mfr. No:

HDTM-6-08-1-S-VT-1-3

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

HDTM-6-08-1-S-VT-1-3 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-6-08-1-S-VT-1-3

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 3 Weeks Estimated factory production time.

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$15.67	$15.67
	$14.52	$145.20
	$13.36	$334.00
	$11.61	$1,114.56
	$9.17	$2,640.96
	$7.96	$4,202.88
	$6.75	$6,804.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Packaging:	Tray
Brand:	Samtec
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	48
Subcategory:	Backplane Connectors

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Datasheet

HDTM-6-08-1-S-VT-1-3 Datasheet (PDF)

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USHTS:: 8536694040

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.