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HPTS-3-S-D-VT

Name: Samtec HPTS-3-S-D-VT
Brand: Samtec
SKU: 200-HPTS-3-S-D-VT
Price: 12.33 USD
Availability: InStock

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Mouser No:

200-HPTS-3-S-D-VT

Mfr. No:

HPTS-3-S-D-VT

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede HD Power Module

Datasheet:

HPTS-3-S-D-VT Datasheet (PDF)

ECAD Model:

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Learn more about Samtec HPTS-3-S-D-VT

In Stock: 78

Stock:: 78 Can Dispatch Immediately

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Factory Lead Time:: 1 Week Estimated factory production time for quantities greater than shown.

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Ext. Price:

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$12.33	$12.33
	$11.37	$113.70
	$10.92	$273.00
	$8.55	$2,308.50
	$8.08	$4,363.20
	$7.56	$8,164.80
2,070	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Connector Modules
Number of Positions:	4 Position
Number of Rows:	2 Row
Termination Style:	Press Fit
Contact Plating:	Gold
Series:	HPTS
Packaging:	Tray
Brand:	Samtec
Contact Material:	Copper Alloy
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Housing Colour:	Black
Housing Material:	Liquid Crystal Polymer (LCP)
Mounting Angle:	Straight
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	90
Subcategory:	Backplane Connectors
Tradename:	XCede
Unit Weight:	8.473 g

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Specification Sheets

Technical Resources

Test Report (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

XCede® HD HPTS 3.20mm Power Modules

Samtec XCede® HD 3.20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. These modules consist of a 12.3A per pin current rating and mount individually to the backplane. Samtech XCede HD HPTS Power Modules are designed using Copper alloy contact material and black PolyPhenylene Sulfide (PPS) insulator material.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.