1-292161-0

TE Connectivity
571-1-292161-0
1-292161-0

Mfr.:

Description:
Headers & Wire Housings HDR PIN 1X10C VRT

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 1,678

Stock:
1,678 Can Dispatch Immediately
Factory Lead Time:
4 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
₪ -.--
Ext. Price:
₪ -.--
Est. Tariff:

Pricing (ILS)

Qty. Unit Price
Ext. Price
₪ 3.66 ₪ 3.66
₪ 3.11 ₪ 31.10
₪ 3.01 ₪ 75.25
₪ 2.65 ₪ 265.00
₪ 2.58 ₪ 645.00
₪ 2.30 ₪ 1,150.00
₪ 2.16 ₪ 2,160.00
₪ 2.09 ₪ 5,225.00
₪ 2.00 ₪ 10,000.00

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Headers & Wire Housings
RoHS:  
Headers
Shrouded
10 Position
2 mm (0.079 in)
1 Row
Through Hole
Solder Pin
Straight
Pin (Male)
Tin
AMP CT
Common Termination
Wire-to-Board
28 AWG to 22 AWG
- 40 C
+ 105 C
Bulk
Brand: TE Connectivity
Contact Material: Brass
Contact Type: Pin (Male)
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 4 A
Housing Colour: Natural
Product Type: Headers & Wire Housings
Factory Pack Quantity: 500
Subcategory: Headers & Wire Housings
Voltage Rating: 125 V
Unit Weight: 440 mg
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

CNHTS:
8538900000
TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

HPI and CT Connectors

TE Connectivity / AMP High Performance Interconnects (HPI) polarized connectors feature reliable wire-to-board sockets and headers that provide audible click feedback when mating. The connectors are available in 2 to 15 positions and accommodate AWG 30 to 24 wire. TE Connectivity / AMP Common Termination (CT) Connectors feature mini 1.5mm and 2mm post header, receptacle, and crimp type housing assemblies for wire-to-board applications. The devices are available in 1 row and 2 row types and feature insulation displacement contacts (IDC).