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GF1500-07-480-50CC

Name: Bergquist Company GF1500-07-480-50CC
Brand: Bergquist Company
SKU: 951-GF150007-48050CC
Price: 27.42 USD
Availability: OutOfStock

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Mouser No:

951-GF150007-48050CC

Mfr. No:

GF1500-07-480-50CC

Mfr.:

Bergquist Company

Description:

Thermal Interface Products Liquid Gap Filler, 50CC Dual Cartridge, Gap Filler TGF 1500/1500, IDH 2168332

This product will be sent to you directly from the manufacturer. You may order this product now. Mouser will notify you of the estimated dispatch date.

Datasheet:

GF1500-07-480-50CC Datasheet (PDF)

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Stock:: 0

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Factory Lead Time:: 4 Weeks Estimated factory production time.

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$27.42	$932.28
	$25.96	$1,298.00
	$25.02	$2,502.00
	$23.83	$5,957.50
1,000	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Bergquist Company
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	Liquid Gap Filler
Package/Case:	Non-standard
Material:	Silicone Elastomer
Thermal Conductivity:	1.8 W/m-K
Color:	Yellow, White
Minimum Operating Temperature:	- 60 C
Maximum Operating Temperature:	+ 200 C
Flammability Rating:	UL 94 V-0
Series:	1500 / TGF 1500
Brand:	Bergquist Company
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	Thermal Interface Products
Factory Pack Quantity:	1
Subcategory:	Thermal Management
Tradename:	Gap Filler
Part # Aliases:	PN0010193 L50CCW0H0D0 2168332

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Technical Resources

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5G Products

Bergquist 5G Products are designed to meet the demanding conditions required for 5G telecom infrastructure components. These highly stable interconnect materials provide fundamental electrical functions for dependable telecom infrastructure performance, ensuring reliable, long-term performance. The Bergquist 5G portfolio features multiple formats, including pads, gels, liquids, and adhesives, to maximize system reliability.

Thermal Gap Fillers

Bergquist Company Thermal Gap Fillers are thermally conductive gap filling liquid materials that enhance thermal performance and enable easier dispensing application for high-volume manufacturing operations. These materials provide high thermal and mechanical performance while inducing virtually zero stress on electronic components during assembly, improving performance and reliability across device assemblies. The liquid, thermal gap filler materials self-level, fill intricate air voids, and conform to highly intricate topographies and multi-level surfaces. This allows delivery of better wet-out for optimized thermal resistance, generally lower than more solid pad-based mediums. Thixotropic qualities also mean the gap fillers hold shape when dispensed.

Data Centre Applications

Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

Router Switch & Network Applications

Bergquist Company Router Switch and Network Applications include phase change materials and thermally conductive adhesives designed to dissipate heat away from thermally sensitive components. The utilization of advanced materials in server motherboards and line cards for routers and switches offers benefits such as scale and cost reduction. One small uptick in performance, repeated thousands of times, provides a notable impact on router and switch performance. Thermal products from Bergquist Company help components function properly for optimal operation.